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US 2026/0256003 A1Published application
Photosensitive composition, transfer film, method for manufacturing laminate, laminate, and semiconductor package
AssigneeFUJIFILM Corporation
InventorKeigo Yamaguchi
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Abstract
An object of the present invention is to provide a photosensitive composition capable of forming a film having excellent migration resistance and excellent resolution. The photosensitive composition according to the embodiment of the present invention includes a polyimide precursor; a polymerizable compound that is a compound different from the polyimide precursor; and a compound represented by Formula (1), in which the polymerizable compound includes a compound having two or more polymerizable groups, and an acid value of the polyimide precursor is 75 mgKOH/g or less.
Claims29
A photosensitive composition comprising:
- a polyimide precursor;
- a polymerizable compound that is a compound different from the polyimide precursor;
- and
- a compound represented by Formula (1),
- wherein the polymerizable compound includes a compound having two or more polymerizable groups, and
- an acid value of the polyimide precursor is 75 mgKOH/g or less,
- in Formula (1), R's each independently represents a substituent, and n's each independently represents an integer of 0 to 5.
4 more elements
Dependencies are inferred from the claim text.