Method for manufacturing wiring board, method for manufacturing semiconductor device, and resin sheet
OwnerMasaya Toba, Kazuyuki Mitsukura +1inventors
InventorsMasaya Toba, Kazuyuki Mitsukura, Masaki Yamaguchi
Life of this patent
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Abstract
A method for manufacturing a wiring board includes preparing a structure body in which a resin sheet having a glass cloth arranged in an organic resin is attached onto a support body having a metal layer provided on a surface thereof or onto a built-in wiring layer provided on the support body, forming a recess by excimer laser in a first resin layer region in which the glass cloth does not exist on a surface side of the resin sheet, forming an opening portion reaching the metal layer on the support body from the surface of the resin sheet, and forming a wiring layer in the recess and the opening portion.
Claims19
A method for manufacturing a wiring board, comprising:
- preparing a structure body in which a resin sheet having a glass cloth arranged in an organic resin is attached onto a support body having a metal layer provided on a surface thereof or onto a built-in wiring layer provided on the support body;
- forming a recess by excimer laser in a first resin layer region in which the glass cloth does not exist on a surface side of the resin sheet;
- forming an opening portion reaching the metal layer on the support body from the surface of the resin sheet;
- and
- forming a wiring layer in the recess and the opening portion.
A method for manufacturing a wiring board, comprising:
- preparing a structure body in which a resin sheet sequentially including a first resin layer region positioned outside and a high elasticity layer region positioned inside with an elastic modulus higher than that of the first resin layer region is attached onto a support body having a metal layer provided on a surface thereof or onto a built-in wiring layer provided on the support body;
- forming a recess by laser or imprinting in the first resin layer region on a surface side of the resin sheet, wherein the recess is formed so as not to reach the high elasticity layer region;
- forming an opening portion reaching the metal layer on the support body from the surface of the resin sheet;
- and
- forming a wiring layer in the recess and the opening portion.
Dependencies are inferred from the claim text.