H10W 70/04
Of leadframes
Official title: of leadframes
H10W70/04 (Of leadframes) appears on 3,104 US grants and 3,291 published applications in this corpus.
Search patents in H10W- Granted patents
- 3,104
- Published applications
- 3,291
- Assignees
- 692
- Inventors
- 4,775
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 14 | 0 |
| 1978 | 6 | 0 |
| 1979 | 7 | 0 |
| 1980 | 7 | 0 |
| 1981 | 5 | 0 |
| 1982 | 4 | 0 |
| 1983 | 8 | 0 |
| 1984 | 2 | 0 |
| 1985 | 5 | 0 |
| 1986 | 9 | 0 |
| 1987 | 8 | 0 |
| 1988 | 11 | 0 |
| 1989 | 17 | 0 |
| 1990 | 14 | 0 |
| 1991 | 21 | 0 |
| 1992 | 23 | 0 |
| 1993 | 31 | 0 |
| 1994 | 33 | 0 |
| 1995 | 28 | 0 |
| 1996 | 30 | 0 |
| 1997 | 36 | 0 |
| 1998 | 27 | 0 |
| 1999 | 42 | 0 |
| 2000 | 31 | 0 |
| 2001 | 49 | 35 |
| 2002 | 56 | 83 |
| 2003 | 60 | 58 |
| 2004 | 57 | 83 |
| 2005 | 60 | 73 |
| 2006 | 76 | 54 |
| 2007 | 59 | 53 |
| 2008 | 50 | 78 |
| 2009 | 28 | 69 |
| 2010 | 56 | 69 |
| 2011 | 68 | 105 |
| 2012 | 79 | 112 |
| 2013 | 96 | 91 |
| 2014 | 110 | 124 |
| 2015 | 145 | 156 |
| 2016 | 157 | 207 |
| 2017 | 192 | 231 |
| 2018 | 195 | 193 |
| 2019 | 160 | 200 |
| 2020 | 181 | 201 |
| 2021 | 149 | 189 |
| 2022 | 127 | 183 |
| 2023 | 144 | 173 |
| 2024 | 134 | 169 |
| 2025 | 115 | 178 |
| 2026 | 72 | 124 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wire bonding using in-situ plasma treatment and apparatus for effecting the same6 Oct 2026US 12,757,746 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of making a multi-chip package device6 Oct 2026US 12,757,800 B2Force Mos Technology Co., Ltd.
- Lead frame with a tie bar having branch part29 Sep 2026US 12,751,294 B2Diodes Incorporated
- Method of manufacturing an interposer product15 Sep 2026US 12,740,435 B2Murata Manufacturing Co., Ltd.
- Metal-ceramic bonded substrate and manufacturing method thereof15 Sep 2026US 12,740,439 B2Dowa Metaltech Co., Ltd.
- Current sensor and manufacturing method of current sensor8 Oct 2026US 2026/0309753 A1Asahi Kasei Microdevices Corporation
- Method of manufacturing semiconductor device8 Oct 2026US 2026/0314432 A1Renesas Electronics Corporation
- Semiconductor package with an embedded interconnect and a method of making the same8 Oct 2026US 2026/0314436 A1Texas Instruments Incorporated
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Semiconductor device with an embedded passive component and method of making the same8 Oct 2026US 2026/0314485 A1Texas Instruments Incorporated
Most cited
By later US patents
- Methods for manufacturing a semiconductor package having a sacrificial layer553US 6,001,671 ATessera, Inc. · 1999
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Saw-singulated leadless plastic chip carrier427US 6,229,200 B1ASAT Ltd. · 2001
- Leadless plastic chip carrier with etch back pad singulation413US 6,498,099 B1ASAT Ltd. · 2002
- Plastic integrated circuit package and method and leadframe for making the package363US 6,143,981 AAmkor Technology, Inc. · 2000