H10W 70/047
Attaching leadframes to insulating supports
Official title: {Attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]}
H10W70/047 (Attaching leadframes to insulating supports) appears on 258 US grants and 197 published applications in this corpus.
Search patents in H10W- Granted patents
- 258
- Published applications
- 197
- Assignees
- 119
- Inventors
- 532
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 3 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 4 | 0 |
| 1987 | 7 | 0 |
| 1988 | 1 | 0 |
| 1989 | 6 | 0 |
| 1990 | 3 | 0 |
| 1991 | 9 | 0 |
| 1992 | 8 | 0 |
| 1993 | 10 | 0 |
| 1994 | 6 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 5 | 0 |
| 1999 | 12 | 0 |
| 2000 | 5 | 0 |
| 2001 | 6 | 5 |
| 2002 | 4 | 3 |
| 2003 | 3 | 4 |
| 2004 | 4 | 6 |
| 2005 | 3 | 2 |
| 2006 | 1 | 3 |
| 2007 | 5 | 2 |
| 2008 | 1 | 4 |
| 2009 | 0 | 3 |
| 2010 | 2 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 4 |
| 2015 | 4 | 8 |
| 2016 | 9 | 15 |
| 2017 | 12 | 17 |
| 2018 | 13 | 13 |
| 2019 | 15 | 14 |
| 2020 | 6 | 10 |
| 2021 | 10 | 15 |
| 2022 | 10 | 12 |
| 2023 | 10 | 18 |
| 2024 | 12 | 17 |
| 2025 | 8 | 8 |
| 2026 | 12 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal-ceramic bonded substrate and manufacturing method thereof15 Sep 2026US 12,740,439 B2Dowa Metaltech Co., Ltd.
- Integrated circuit having a routable leadframe11 Aug 2026US 12,707,986 B2Texas Instruments Incorporated
- Semiconductor package film and manufacturing method thereof11 Aug 2026US 12,707,990 B2Samsung Display Co., Ltd.
- Electronic package with concave lead end faces11 Aug 2026US 12,708,008 B2Texas Instruments Incorporated
- Power module and method for manufacturing same4 Aug 2026US 12,702,030 B2Hyundai Motor Company
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Molded package with press-fit conductive pins17 Sep 2026US 2026/0282975 A1
- Packaged device, method for manufacturing, and lead frame27 Aug 2026US 2026/0255985 A1NXP USA, Inc.
- Power module package with stacked direct bonded metal substrates30 Jul 2026US 2026/0223750 A1Semiconductor Components Industries, LLC
- Semiconductor package having a die pad, a semiconductor transistor die and a layer structure having a ceramic layer23 Jul 2026US 2026/0215294 A1Infineon Technologies Austria AG
Most cited
By later US patents
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Microelectronic mounting with multiple lead deformation and bonding201US 5,801,441 ATessera, Inc. · 1998
- Fan-out semiconductor chip assembly189US 5,688,716 ATessera, Inc. · 1997
- Microelectronic assembly fabrication with terminal formation from a conductive layer173US 5,989,936 ATessera, Inc. · 1999
- Microelectronic assemblies with multiple leads152US 6,194,291 B1Tessera, Inc. · 2001