Power module and method for manufacturing same

A power module comprising:

• a first substrate;
• a second substrate spaced apart from the first substrate and comprising at least one metal layer;
• at least one chip disposed between the first substrate and the second substrate and in electrical contact with the at least one metal layer;
• and
• a third substrate spaced apart from the first substrate and the second substrate, and electrically connecting the at least one chip and at least one lead frame, the third substrate comprising one or more conductive patterns,
• wherein each of the conductive patterns is connected to one lead frame of the at least one lead frame, and is formed in a multi-layer circuit structure such that the one or more conductive patterns are not short-circuited to each other,
• wherein each of the conductive patterns is disposed on a different layer of the third substrate such that even though crossing and passing on the same plane, the different conductive patterns are spaced apart from each other in space so as to prevent short-circuiting between the conductive patterns,
• wherein the at least one lead frame comprises a first lead frame in electrical contact with the at least one metal layer,
• wherein the chip receives power through the first lead frame and the at least one metal layer,
• wherein the at least one lead frame comprises a second lead frame spaced apart from the first substrate and the second substrate, and
• wherein the third substrate is disposed on the second lead frame.