Integrated circuit having a routable leadframe

A method of fabricating an integrated circuit, the method comprising:

• providing a metal carrier, the metal carrier having a metal carrier layer deposited on a surface of the metal carrier;
• depositing a metal layer on the metal carrier layer, the metal layer comprising metal traces, metal pillars disposed on the metal traces, and leads;
• patterning a photoresist material layer on the leads;
• forming a dielectric layer over the metal layer, surfaces of the metal pillars being exposed from a first surface of the dielectric layer;
• removing the photoresist material layer from the leads;
• removing the metal carrier;
• attaching a die to the first surface of the dielectric layer, the die including electrical contacts on a surface of the die that contacts the dielectric layer, the electrical contacts being aligned with and electrically connecting with the exposed surfaces of the metal pillars;
• attaching a bonding wire from the die to at least one of the metal traces and/or at least one of the leads;
• forming a mold compound over the die, the dielectric layer, and the metal layer;
• and
• bending the leads in a direction away from the die to facilitate connection to a circuit board, wherein surfaces of the metal traces are exposed from a second surface of the dielectric layer opposite the first surface and are not covered by the mold compound.

An electronic device, comprising:

• a dielectric layer;
• a metal layer embedded in the dielectric layer, the metal layer including leads, metal traces, and metal pillars, surfaces of the metal pillars being exposed from a first surface of the dielectric layer;
• a die attached to the first surface of the dielectric layer, the die including electrical contacts on a first surface of the die that contacts the dielectric layer, the electrical contacts being aligned with and electrically connecting with the exposed surfaces of the metal pillars;
• bonding wires that extend from pins on a second surface of the die opposite the first surface that contacts the dielectric layer to at least one of the metal traces and/or at least one of the leads;
• and
• a mold compound over the dielectric layer, the metal layer, and the die,
• wherein surfaces of the metal traces are exposed from a second surface of the dielectric layer opposite the first surface and are not covered by the mold compound.