Power module package with stacked direct bonded metal substrates
AssigneeSemiconductor Components Industries, LLC
InventorsJonghwan BAEK, JeongHyuk PARK, Seungwon IM, Keunhyuk LEE, Dukyong LEE
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Abstract
A package includes a first direct bonded metal (DBM) substrate, a first semiconductor die disposed on a top surface of the first DBM substrate, a second DBM substrate disposed at a height above the first DBM substrate, and a second semiconductor die disposed on a top surface of the second DBM substrate. A wire bond is made between the first semiconductor die disposed on the top surface of the first DBM substrate and the second semiconductor die disposed on the top surface of the second DBM substrate.
Claims20
A package comprising:
- a first substrate;
- a first semiconductor die disposed on a top surface of the first substrate;
- a second substrate disposed above the first substrate and above a first portion of the first semiconductor die, the first portion being disposed in a gap directly between the second substrate and the first substrate, a second portion of the first semiconductor die extending outside of the gap;
- a second semiconductor die disposed on a top surface of the second substrate;
- a first lead frame attached to a first trace pattern on the top surface of the first substrate;
- and
- a second lead frame attached to a second trace pattern on the top surface of the second substrate.
A package comprising:
- an upper substrate;
- a lower substrate below the upper substrate, a region of a top surface of the lower substrate being defined by a vertical projection of the upper substrate onto the lower substrate;
- a plurality of first semiconductor dies disposed on the lower substrate, each of the plurality of first semiconductor dies including a first portion disposed within the region and a second portion disposed outside of the region;
- a plurality of second semiconductor dies disposed on the upper substrate;
- a first lead frame attached to a first trace pattern on the top surface of the lower substrate;
- and
- a second lead frame attached to a second trace pattern on the top surface of the upper substrate.
A method comprising:
- disposing a first semiconductor die on a top surface of a first substrate;
- disposing a second substrate above the first substrate and above a first portion of the first semiconductor die, the first portion being disposed in a gap directly between the second substrate and the first substrate, a second portion of the first semiconductor die extending outside of the gap;
- disposing a second semiconductor die on a top surface of the second substrate;
- attaching a first lead frame to a first trace pattern on the top surface of the first substrate;
- and
- attaching a second lead frame to a second trace pattern on the top surface of the second substrate.
Dependencies are inferred from the claim text.