Metal-ceramic bonded substrate and manufacturing method thereof
AssigneeDowa Metaltech Co., Ltd.
InventorAyumu Ozaki
Life of this patent
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Abstract
In a metal-ceramic bonded substrate in which a metal circuit board is bonded to one surface of a ceramic substrate through a brazing material layer, an overhang portion of the brazing material layer overhanging outward by 80 μm or more from a lower edge portion of a side surface of the metal circuit board is formed, the side surface of the metal circuit board has an inclination angle θ of 75° or more with respect to a surface of the ceramic substrate, and the side surface of the metal circuit board and the overhang portion of the brazing material layer are covered with an insulating layer. The metal-ceramic bonded substrate has good partial discharge characteristics and excellent heat cycle resistance and heat resistance.
Claims14
A metal-ceramic bonded substrate in which a metal circuit board is bonded to one surface of a ceramic substrate through a brazing material layer, comprising:
- an overhang portion of the brazing material layer overhanging outward by 80 μm or more from a lower edge portion of a side surface of the metal circuit board;
- the side surface of the metal circuit board having an inclination angle in a range of 75° or more to 100° or less with respect to the surface of the ceramic substrate,
- the inclination angle is defined as an angle formed between a first straight line, which connects an upper edge of the metal circuit board and a position on the side surface at half a thickness of the metal circuit board, and a second straight line that extends parallel to the one surface of the ceramic substrate and passes through the position on the side surface, and
- an insulating layer covering the side surface of the metal circuit board and the overhang portion of the brazing material layer.
Dependencies are inferred from the claim text.