Method of manufacturing semiconductor device
AssigneeRenesas Electronics Corporation
InventorAtsushi SAKAZAKI
Life of this patent
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Abstract
A method of manufacturing a semiconductor device includes a lead frame preparation step, a sealing step, a half dicing step, a metal film formation step (plating step), and a singulation step. Each of a first lead and a second lead prepared in the lead frame preparation step includes: a first portion having a portion removed by a first blade in the half dicing step; and a second portion that is not removed in the half dicing step. In the singulation step, a tie bar is cut by inserting a second blade between a remaining portion of the first portion of the first lead and a remaining portion of the first portion of the second lead.
Claims9
A method of manufacturing a semiconductor device, comprising steps of:
- (a) preparing a lead frame including:
- a first lead provided in a first device formation portion,
- a second lead provided in a second device formation portion located adjacent to the first device formation portion, and
- a tie bar provided in a dicing portion between the first device formation portion and the second device formation portion, the tie bar being connected to each of the first lead and the second lead;
- (b) after the step of (a), mounting a first semiconductor chip on the first device formation portion, and mounting a second semiconductor chip on the second device formation portion;
- (c) after the step of (b), electrically connecting the first lead and the first semiconductor chip to each other via a first conductive member, and electrically connecting the second lead and the second semiconductor chip to each other via a second conductive member;
- (d) after the step of (c), forming a sealing body that collectively seals the first lead, the second lead, the tie bar, the first semiconductor chip, the second semiconductor chip, the first conductive member, and the second conductive member such that a lower surface of each of the first lead and the second lead is exposed;
- (e) after the step of (d), removing a portion of each of the first lead and the second lead using a first blade having a first width greater than a width of the tie bar;
- (f) after the step of (e), forming a metal film by a plating method on an exposed surface of the lead frame that is exposed from the sealing body;
- and
- (g) after the step of (f), removing the tie bar and the sealing body using a second blade having a second width smaller than the first width, thereby separating the first device formation portion and the second device formation portion from each other,
- wherein the tie bar of the lead frame prepared in the step of (a), includes:
- a lead connection portion extending in a first direction from the first lead toward the second lead in plan view;
- and
- a support portion extending in a second direction intersecting the first direction in plan view,
- wherein, in the step of (a), with an upper surface of each of the first lead and the second lead serving as a reference plane, a height difference between a lower surface of the tie bar and the reference plane is smaller than a height difference between the lower surface of each of the first lead and the second lead and the reference plane,
- wherein each of the first lead and the second lead of the lead frame prepared in the step of (a), includes:
- a first portion having the portion removed by the first blade in the step of (e);
- and
- a second portion that is not removed in the step of (e), and
- wherein, in the step of (g), the tie bar is cut by inserting the second blade between a remaining portion of the first portion of the first lead and a remaining portion of the first portion of the second lead.
Dependencies are inferred from the claim text.