H10W 70/042
Etching
Official title: {Etching}
H10W70/042 (Etching) appears on 1,162 US grants and 1,250 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,162
- Published applications
- 1,250
- Assignees
- 306
- Inventors
- 1,686
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 10 | 0 |
| 2000 | 7 | 0 |
| 2001 | 12 | 14 |
| 2002 | 24 | 41 |
| 2003 | 24 | 22 |
| 2004 | 22 | 34 |
| 2005 | 27 | 37 |
| 2006 | 47 | 19 |
| 2007 | 33 | 31 |
| 2008 | 25 | 41 |
| 2009 | 18 | 47 |
| 2010 | 30 | 46 |
| 2011 | 46 | 67 |
| 2012 | 54 | 76 |
| 2013 | 66 | 58 |
| 2014 | 67 | 49 |
| 2015 | 70 | 54 |
| 2016 | 54 | 65 |
| 2017 | 74 | 71 |
| 2018 | 70 | 62 |
| 2019 | 42 | 65 |
| 2020 | 68 | 62 |
| 2021 | 43 | 52 |
| 2022 | 49 | 65 |
| 2023 | 44 | 44 |
| 2024 | 47 | 51 |
| 2025 | 30 | 48 |
| 2026 | 22 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Integrated circuit having a routable leadframe11 Aug 2026US 12,707,986 B2Texas Instruments Incorporated
- Electronic package with concave lead end faces11 Aug 2026US 12,708,008 B2Texas Instruments Incorporated
- Etch profile control of interconnect structures4 Aug 2026US 12,701,976 B2Taiwan Semiconductor Manufacturing Company, Ltd.
- Semiconductor devices and methods of manufacturing semiconductor devices28 Jul 2026US 12,696,773 B2Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor packaging method21 Jul 2026US 12,690,467 B2CR Runan Technologies (Chongqing) Co. Ltd.
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Semiconductor device with an embedded passive component and method of making the same8 Oct 2026US 2026/0314485 A1Texas Instruments Incorporated
- Metal frame chip embedded packaging substrate and manufacturing method thereof1 Oct 2026US 2026/0305377 A1Zhuhai ACCESS Semiconductor Co., Ltd.
- Semiconductor devices and methods of manufacturing semiconductor devices27 Aug 2026US 2026/0255987 A1Amkor Technology Singapore Holding Pte.Ltd.
- Laser texturing of semiconductor die borders for mold adhesion enhancement27 Aug 2026US 2026/0255988 A1Tesla, Inc.
Most cited
By later US patents
- Methods for manufacturing a semiconductor package having a sacrificial layer553US 6,001,671 ATessera, Inc. · 1999
- Saw-singulated leadless plastic chip carrier427US 6,229,200 B1ASAT Ltd. · 2001
- Leadless plastic chip carrier with etch back pad singulation413US 6,498,099 B1ASAT Ltd. · 2002
- Saw-singulated leadless plastic chip carrier339US 6,242,281 B1ASAT Ltd. · 2001
- Exposed die leadless plastic chip carrier303US 6,294,100 B1ASAT Ltd. · 2001