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US 2026/0255987 A1Published application
Semiconductor devices and methods of manufacturing semiconductor devices
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsHyeong Il JEON, Byong Jin KIM, Gi Jeong KIM
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Abstract
In one example, a semiconductor device includes a substrate. The substrate includes a base including a top side and a cavity side opposite to the top side, leads extending from the cavity side, and an encapsulant interposed between the leads. An electronic component is located on the cavity side and spaced apart from the encapsulant. Other examples and related methods are also disclosed herein.
Claims20
A method for manufacturing a semiconductor device, comprising:
- providing an encapsulated substrate comprising:
- a conductive substrate having a first side and a second side opposite the first side;
- first grooves in the conductive substrate extending inward from one of the first side or the second side of the conductive substrate to define laterally spaced leads and a base between the laterally spaced leads;
- an encapsulant in the first grooves such that the encapsulant is interposed between the laterally spaced leads;
- a cavity in the conductive substrate extending inward from one of the first side or the second side, the cavity being bounded by proximal sidewalls of the laterally spaced leads;
- second grooves in the conductive substrate at a location outside a perimeter of the cavity, the second grooves extending inward from a same side of the conductive substrate from which the cavity is formed and defining lead flanks of the laterally spaced leads, each lead flank comprising a flank ceiling and a flank sidewall;
- and
- a conductive coating over exposed surfaces of the base and the laterally spaced leads;
- coupling an electronic component to a floor of the cavity, the electronic component being laterally spaced apart from the encapsulant;
- and
- singulating the conductive substrate through the encapsulant and the second grooves.
8 more elements
A semiconductor device, comprising:
- a conductive substrate comprising:
- a base having a first side and a second side opposite the first side, and
- leads extending from a cavity side of the base, each lead having a proximal side oriented toward the base and a distal side oriented away from the base, and the leads being laterally spaced apart;
- first grooves recessed inward from one of the first side or the second side of the conductive substrate and interposed between adjacent ones of the leads, the first grooves being filled with an encapsulant such that the encapsulant is interposed between the leads;
- a cavity recessed inward from one of the first side or the second side of the conductive substrate, the cavity being bounded by proximal sidewalls of the leads and having a floor defined by the cavity side of the base;
- second grooves recessed inward from one of the first side or the second side of the conductive substrate and located outside a perimeter of the cavity, the second grooves defining lead flanks of the leads, each lead flank comprising a flank ceiling and a flank sidewall;
- a conductive coating on exposed surfaces of the base and the leads;
- and
- an electronic component disposed in the cavity and coupled to the floor of the cavity through the conductive coating, the electronic component having lateral sides that are spaced apart from the encapsulant such that a region between the electronic component and the proximal sidewalls of the leads is free of the encapsulant, and terminals of the electronic component being exposed at a side of the semiconductor device opposite the cavity side.
6 more elements
A semiconductor device, comprising:
- a conductive substrate comprising:
- a base having a first side and a second side opposite the first side, and
- leads extending from a cavity side of the base, each lead having a proximal side oriented toward the base and a distal side oriented away from the base;
- grooves recessed inward from one of the first side or the second side of the conductive substrate and interposed between adjacent ones of the leads, the grooves being filled with an encapsulant such that the encapsulant is interposed between the leads;
- a cavity recessed inward from one of the first side or the second side of the conductive substrate, the cavity being bounded by proximal sidewalls of the leads and having a floor defined by the cavity side of the base;
- lead flanks defined by recessed portions of the conductive substrate located outside a perimeter of the cavity, each lead flank comprising a flank ceiling and a flank sidewall;
- a conductive coating disposed on exposed surfaces of the base and the leads including the flank ceiling and the flank sidewall of each lead flank;
- and
- an electronic component disposed in the cavity and coupled to the floor of the cavity through the conductive coating, the electronic component having lateral sides that are spaced apart from the encapsulant such that a region between the electronic component and the proximal sidewalls of the leads is free of the encapsulant, and terminals of the electronic component being exposed at a side of the semiconductor device opposite the cavity side.
6 more elements
Dependencies are inferred from the claim text.