Semiconductor devices and methods of manufacturing semiconductor devices

A method to manufacture an electronic device, comprising:

• providing a first substrate comprising a base;
• providing an electronic component over the first substrate and comprising:
• a top side and a bottom side,
• a first terminal and a second terminal on the top side, and
• a third terminal on the bottom side,
• wherein the third terminal is coupled with the first substrate;
• providing a second substrate over the electronic component;
• and
• providing an encapsulant over the first substrate, contacting a lateral side of the electronic component, and contacting the second substrate, wherein the encapsulant comprises a unitary body;
• wherein:
• a first lead extends into an interior portion of the encapsulant and is coupled with and extends over the base of the first substrate;
• a second lead of the second substrate is coupled to the first terminal of the electronic component;
• the first substrate is separate from the first lead;
• a connecting lead couples the first lead to the first substrate, wherein a height of the connecting lead is greater than a width of the connecting lead;
• a third lead of the second substrate is coupled to the second terminal of the electronic component;
• the first lead, the second lead, and the third lead are exposed from a top side of the encapsulant;
• the first lead and the first substrate are coupled to the connecting lead at the interior portion of the encapsulant;
• a top side of the unitary body is above a top side of the connecting lead;
• the second substrate comprises a trace, the encapsulant contacts a top side of the trace,
• the second lead comprises a vertical protrusion extending from a top side of the trace to the top side of the encapsulant;
• and
• a length of the trace is greater than a height of the vertical protrusion.

A module device, comprising:

• a first module substrate comprising a first dielectric structure and a first conductive structure, wherein a first lateral side of the first module substrate is exposed;
• a second module substrate comprising a second dielectric structure and a second conductive structure, wherein a first lateral side of the second module substrate is exposed;
• an electronic device between the first module substrate and the second module substrate and coupled with the first conductive structure and the second conductive structure;
• and
• a module encapsulant between the first module substrate and the second module substrate and contacting a lateral side of the electronic device;
• wherein a lateral side of the module encapsulant is flush with the first lateral side of the first module substrate and the first lateral side of the second module substrate, and wherein a top side of the module encapsulant contacts a bottom side of the first module substrate, and a bottom side of the module encapsulant contacts a top side of second module substrate;
• wherein the electronic device comprises:
• a first device substrate comprising a base;
• an electronic component over the first device substrate and comprising:
• a top side and a bottom side,
• a first terminal and a second terminal on the top side, and
• a third terminal on the bottom side,
• wherein the third terminal is coupled with the first device substrate;
• a second device substrate over the electronic component;
• and
• a device encapsulant over the first device substrate and contacting a lateral side of the electronic component and contacting the second device substrate;
• and
• wherein:
• a first lead is coupled with the base and extends over the base of the first device substrate;
• a second lead of the second device substrate is coupled to the first terminal of the electronic component;
• a connecting lead couples the first lead to the first device substrate, wherein a height of the connecting lead is greater than a width of the connecting lead;
• the first lead and the second lead are exposed from a top side of the device encapsulant;
• the second device substrate comprises a trace, the device encapsulant contacts a top side of the trace, and the second lead comprises a vertical protrusion extending from a top side of the trace to the top side of the device encapsulant;
• and
• a length of the trace is greater than a height of the vertical protrusion.