Saw-singulated leadless plastic chip carrier
AssigneeASAT Ltd.
InventorsNeil Mclellan, Nelson Fan
Life of this patent
Estimating the term…
Abstract
Leadless plastic chip carriers are formed from a matrix of lead frames provided in a section of a metal strip. Each lead frame in the matrix includes a die-attach pad and multiple leads disposed in close proximity to the die-attach pad. After a semiconductor die is attached to each of the die-attach pad and wire-bonded, the leadless plastic chip carriers are formed by providing a plastic encapsulation which exposes the bottom sides of the die-attach pad and the leads. The bottom sides of the leads serve as solder pads to be used for attaching the leadless plastic chip carrier to a printed circuit board.
Claims12
A process for forming a plastic carrier, comprising:
- forming a matrix of lead frames arranged in a 2-dimensional regular pattern out of a metal strip, each lead frame including a die-attach pad and a plurality of leads disposed in close proximity to said die-attach pad, said die-attach pad and said leads each having a bottom surface and a top surface;
- attaching to the top surface of each die-attach pad a semiconductor die, said semiconductor die having a plurality of bonding pads formed thereon;
- providing bond wires to electrically connect each of said bonding pads to the top surface of a corresponding lead;
- and
- encapsulating said matrix of lead frames, including said die-attach pads, said semiconductor dies, said bond wires and said leads, in a resin material such that said bottom surfaces of said die-attach pads and said bottom surfaces of said leads are exposed.
Dependencies are inferred from the claim text.