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US 2026/0314485 A1Published application
Semiconductor device with an embedded passive component and method of making the same
AssigneeTexas Instruments Incorporated
InventorsJovenic R. Esquejo, Alliyah Veil Papio, Von Mark Mendoza, Kenneth Tungol
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Abstract
A semiconductor package is disclosed that includes a die and a leadframe. The leadframe can include a die pad to which the die can be coupled and a set of leads comprising surfaces. A passive component can be coupled to the surfaces of the set of leads, which can be at least in electrical connection with the die.
Claims20
A semiconductor package comprising:
- a die;
- a leadframe comprising:
- a die pad to which the die is coupled;
- and
- a set of leads comprising surfaces, wherein a passive component is coupled to the surfaces of the set of leads, which are at least in electrical connection with the die.
2 more elements
A method comprising
- providing one or more leadframe assemblies, each leadframe assembly comprising a die pad and a set of leads, each lead of the set of leads comprising an inner lead arm extending toward the die pad from a periphery portion of a respective leadframe assembly;
- attaching a passive component to the inner lead arms;
- attaching a die to the die pad of each leadframe assembly;
- forming electrical connections between the die and the respective leadframe assembly;
- applying a molding material to encapsulate at least a portion of each leadframe assembly to provide one or more molded leadframe assemblies;
- and
- processing the one or more molded leadframe assemblies to form one or more semiconductor packages.
4 more elements
A method comprising:
- providing a leadframe strip comprising multiple leadframe assemblies, each leadframe assembly including a die pad and a set of leads, each lead of the set of leads comprising an inner lead arm extending toward the die pad from a periphery portion of the leadframe assembly;
- attaching a passive component to the inner lead arms of each leadframe assembly in the leadframe strip;
- attaching a die to the die pad of each leadframe assembly;
- forming electrical connections between each die and the corresponding leadframe assembly;
- applying a molding material to encapsulate at least a portion of each leadframe assembly, thereby providing a molded leadframe strip;
- and
- processing the molded leadframe strip to form a plurality of semiconductor packages by separating individual leadframe assemblies from the molded leadframe strip.
4 more elements
Dependencies are inferred from the claim text.