H10W 70/048
Mechanical treatments
Official title: {Mechanical treatments, e.g. punching, cutting, deforming or cold welding}
H10W70/048 (Mechanical treatments) appears on 868 US grants and 1,002 published applications in this corpus.
Search patents in H10W- Granted patents
- 868
- Published applications
- 1,002
- Assignees
- 307
- Inventors
- 1,754
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 4 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 9 | 0 |
| 1993 | 11 | 0 |
| 1994 | 13 | 0 |
| 1995 | 16 | 0 |
| 1996 | 12 | 0 |
| 1997 | 11 | 0 |
| 1998 | 10 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 8 | 8 |
| 2002 | 17 | 26 |
| 2003 | 24 | 21 |
| 2004 | 17 | 28 |
| 2005 | 16 | 27 |
| 2006 | 18 | 17 |
| 2007 | 15 | 13 |
| 2008 | 16 | 21 |
| 2009 | 6 | 13 |
| 2010 | 21 | 15 |
| 2011 | 16 | 31 |
| 2012 | 18 | 24 |
| 2013 | 19 | 14 |
| 2014 | 21 | 37 |
| 2015 | 45 | 60 |
| 2016 | 37 | 57 |
| 2017 | 59 | 62 |
| 2018 | 57 | 64 |
| 2019 | 54 | 69 |
| 2020 | 53 | 58 |
| 2021 | 46 | 55 |
| 2022 | 35 | 48 |
| 2023 | 35 | 50 |
| 2024 | 32 | 60 |
| 2025 | 41 | 69 |
| 2026 | 25 | 55 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing an interposer product15 Sep 2026US 12,740,435 B2Murata Manufacturing Co., Ltd.
- Semiconductor device and method of manufacturing semiconductor device8 Sep 2026US 12,733,514 B2Mitsubishi Electric Corporation
- Adhesive dispense unit25 Aug 2026US 12,721,090 B2Nexperia B. V.
- Electronic package with concave lead end faces11 Aug 2026US 12,708,008 B2Texas Instruments Incorporated
- Interconnect strips11 Aug 2026US 12,708,022 B2Texas Instruments Incorporated
- Current sensor and manufacturing method of current sensor8 Oct 2026US 2026/0309753 A1Asahi Kasei Microdevices Corporation
- Method of manufacturing semiconductor device8 Oct 2026US 2026/0314432 A1Renesas Electronics Corporation
- Semiconductor device with an embedded passive component and method of making the same8 Oct 2026US 2026/0314485 A1Texas Instruments Incorporated
- Double sided multi chip for leaded package1 Oct 2026US 2026/0305380 A1
- Power semiconductor package including a molded body with protrusion and method for fabricating the same1 Oct 2026US 2026/0305381 A1
Most cited
By later US patents
- Plastic integrated circuit package and method and leadframe for making the package363US 6,143,981 AAmkor Technology, Inc. · 2000
- Semiconductor package and method for making the same229US 6,355,502 B1National Science Council · 2002
- Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal207US 5,070,039 ATexas Instruments Incorporated · 1991
- Partially patterned lead frames and methods of making and using the same in semiconductor packaging200US 6,812,552 B2Advanced Interconnect Technologies Limited · 2004
- Method for packaging a semiconductor die154US 5,696,033 AMicron Technology, Inc. · 1997