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US 12,721,090 B2Granted
Adhesive dispense unit
AssigneeNexperia B.V.
InventorsErik Eltink, Theo ter Steeg
Life of this patent
Estimating the term…
Abstract
This disclosure relates to an adhesive dispense unit for a semiconductor die bonding apparatus. The adhesive dispense unit includes an adhesive dispense nozzle and a pin member; the pin member comprising a down stand portion and a sheath portion, and the down stand is reciprocatable within the sheath portion.
Claims20
A method of dispensing an adhesive, the method comprising
- (a) positioning an adhesive dispense unit for a semiconductor die bonding apparatus above a work holder holding a lead frame in place,
- (b) forming a droplet of liquid adhesive on a dispense needle of the adhesive dispense unit,
- (c) moving the adhesive dispense unit towards the lead frame on the work holder, wherein,
- when a down stand of a pin member that is reciprocatable within an enclosure of the adhesive dispense unit contacts the lead frame, and the down stand portion is biased in the enclosure by a resilient bias member, and the method further comprises
- (d) forcing, by the downstand, the lead frame onto the work holder,
- (e) moving the dispense needle towards the lead frame, forced onto the work holder, until the droplet of liquid adhesive on the dispense needle contacts the lead frame, and
- (f) dispensing the droplet of liquid adhesive on the dispense needle onto the lead frame.
4 more elements
An adhesive dispense unit for a semiconductor die bonding apparatus, the adhesive dispense unit comprising:
- an adhesive dispense nozzle;
- and
- a pin member comprising a down stand portion that is reciprocatable within an enclosure of the adhesive dispense unit for the semiconductor die bonding apparatus, wherein the down stand portion is biased in the enclosure by a resilient bias member.
A method of operating an adhesive dispense unit for a semiconductor die bonding apparatus, the method comprising:
- holding a semiconductor leadframe to a work holder;
- forming a droplet of liquid adhesive at the opening of an adhesive dispense nozzle of an adhesive dispense unit for the semiconductor die bonding apparatus, the adhesive dispense unit comprising a pin member including a down stand portion that is reciprocatable within a sheath portion;
- contacting the down stand portion of the pin member to the semiconductor leadframe the work holder;
- and
- dispensing the liquid adhesive onto the semiconductor leadframe.
2 more elements
Dependencies are inferred from the claim text.