Power semiconductor package including a molded body with protrusion and method for fabricating the same

A method for fabricating a power semiconductor package, the method comprising:

• providing a leadframe comprising a plurality of first leads;
• electrically connecting a power semiconductor die to the leadframe;
• and
• molding over the power semiconductor die, thereby forming a molded body, the molded body comprising a first side, an opposite second side, and lateral sides connecting the first and second sides,
• wherein the first leads protrude from a first one of the lateral sides of the molded body,
• wherein the first leads comprise end faces facing away from the first one of the lateral sides of the molded body and lateral faces extending from the first one of the lateral sides to the respective end face,
• wherein at least two opposite lateral faces of each of the first leads are covered by protrusions of the molded body.