Interconnect strips
AssigneeTexas Instruments Incorporated
InventorChih-Chien Ho
Life of this patent
Estimating the term…
Abstract
A method for forming integrated circuit (IC) packages includes mounting dies on a strip of interconnects and applying wire bonds in regions of the strip of interconnects proximate to mold shields. The method also includes adjusting the mold shields of the strip of interconnects. The method includes flowing a mold compound on the strip of interconnects to form a strip of IC packages. Mold injection pressure causes the mold compound to flow from a first end of the strip of interconnects across the strip of interconnects to a second end of the strip of interconnects, and the mold shields impede the flow of the mold compound through the regions of the strip of interconnects proximate to the mold shields. The method includes singulating the strip of IC packages to form the IC packages.
Claims20
A method for forming integrated circuit (IC) packages comprising:
- mounting dies on a strip of interconnects;
- applying wire bonds in regions of the strip of interconnects proximate to mold shields;
- adjusting the mold shields of the strip of interconnects;
- flowing a mold compound on the strip of interconnects to form a strip of IC packages, wherein mold injection pressure causes the mold compound to flow from a first end of the strip of interconnects, across the strip of interconnects and to a second end of the strip of interconnects, and the mold shields impede the flow of the mold compound through regions of the strip of interconnects proximate to the mold shields;
- and
- singulating the strip of IC packages to form the IC packages.
A method for forming integrated circuit (IC) packages comprising:
- mounting dies on a strip of interconnects;
- applying wire bonds in regions of the strip of interconnects proximate to mold shields;
- adjusting the mold shields of the strip of interconnects;
- flowing a mold compound on the strip of interconnects to form a strip of IC packages, wherein mold injection pressure causes the mold compound to flow from a first end of the strip of interconnects, across the strip of interconnects and to a second end of the strip of interconnects, and the mold shields impede the flow of the mold compound through regions of the strip of interconnects proximate to the mold shields;
- and
- laser sawing the strip of IC packages to remove the mold shields and form the IC packages.
A method for forming integrated circuit (IC) packages comprising:
- mounting dies on a strip of interconnects;
- applying wire bonds in regions of the strip of interconnects proximate to mold shields;
- adjusting the mold shields of the strip of interconnects;
- flowing a mold compound on the strip of interconnects to form a strip of IC packages, wherein mold injection pressure causes the mold compound to flow from a first end of the strip of interconnects, across the strip of interconnects and to a second end of the strip of interconnects, and the mold shields impede the flow of the mold compound through regions of the strip of interconnects proximate to the mold shields;
- and
- singulating the strip of IC packages into 7 or more IC packages.
A method for forming integrated circuit (IC) packages comprising:
- mounting dies on a strip of interconnects;
- applying wire bonds in regions of the strip of interconnects proximate to mold shields;
- bending the mold shields from an angle parallel to a backplane of the strip of interconnects in the strip of interconnects to form an acute angle or a right angle;
- flowing a mold compound on the strip of interconnects to form a strip of IC packages, wherein mold injection pressure causes the mold compound to flow from a first end of the strip of interconnects, across the strip of interconnects and to a second end of the strip of interconnects, and the mold shields impede the flow of the mold compound through regions of the strip of interconnects proximate to the mold shields;
- and
- singulating the strip of IC packages to form the IC packages.
A strip of integrated circuit (IC) packages comprising:
- a strip of interconnects comprising mold shields arranged in a center region of the strips of interconnects, the mold shields forming a right angle or an acute angle;
- dies mounted on the strips of interconnects;
- wire bonds in the center region of the strips of interconnects;
- and
- a mold compound encapsulating the strip of interconnects, wherein the mold shields protrude out of the mold compound.
Dependencies are inferred from the claim text.