Method of manufacturing an interposer product

Abstract

A method of manufacturing an interposer product that includes: forming on a same side of an interposer substrate, by a common process, first and second portions of a gold layer, wherein the first portion of the gold layer constitutes a wire-bonding pad; depositing a Au—Sn solder on the second portion of the gold layer, the Au—Sn solder comprising a gold-tin alloy having a first composition; merging the deposited Au—Sn solder with the second portion of the gold layer by performing a reflow process to form at least one bonding bump, wherein a majority of the bonding bump is made of a eutectic composition of the gold-tin alloy, and wherein the first composition has a smaller proportion of gold than is in the eutectic composition of the gold-tin alloy; and planarizing the bonding bump to form a flat bonding bump having a selected height.

Dependencies are inferred from the claim text.