Semiconductor device and method of manufacturing semiconductor device

A semiconductor device comprising:

• a conductive die bond;
• a semiconductor element electrically connected to the die bond;
• a sealing resin being an insulating resin sealing the semiconductor element therein;
• and
• a plurality of electrode terminals electrically connected to the die bond and protruding from the sealing resin each including a root portion being a root protruding from the sealing resin, a tip portion being a tip and portion extending from the root portion, and a middle portion provided between the tip portion and the root portion, wherein
• the plurality of electrode terminals are aligned along a first direction and protrude from the sealing resin in a second direction orthogonal to the first direction, and
• the middle portion includes a first middle portion having a width wider than those of the root portion and the tip portion in the first direction, and a second middle portion having a width wider than that of the root portion in the first direction, and a width narrower than that of the first middle portion in the first direction, and having a bent portion bent toward in a third direction orthogonal to the first direction and the second direction, the bent portion having a bending center being a center between a bending start point being a start point of bending and a bending end point being an end point of bending, and the bending center is located in the second middle portion.