Method for packaging a semiconductor die
AssigneeMicron Technology, Inc.
InventorLarry D. Kinsman
Life of this patent
Estimating the term…
Abstract
A method for packaging a semiconductor die includes the steps of: attaching the die to a lead-on-chip (LOC) leadframe; electrically connecting bond pads on the die to lead fingers on the leadframe; forming a glob top on the bond pads and a portion of the lead fingers; and then trimming and forming the lead fingers into leads. The glob top protects the bond pads and leads and secures the leads to the die. In addition, the glob top leaves most of a face of the die exposed. The completed package has a small footprint which matches the peripheral shape of the die. During the packaging process a support structure such as a molded carrier ring can be formed on the leadframe to facilitate handling and testing of the singulated die.
Claims31
A method for packaging a semiconductor die comprising:
- providing a leadframe comprising a lead;
- attaching the die to the leadframe;
- electrically connecting a portion of the lead to a bond pad on the die;
- forming an encapsulating material on the bond pad and over the portion of the lead and a portion of a face of the die while leaving a remaining portion of the lead and a remaining portion of the die exposed;
- and
- trimming the lead from the leadframe to form a package comprising the die and the lead, with the encapsulating material exposed and protecting the bond pad and the portion of the lead.
A method for packaging a semiconductor die comprising:
- providing a leadframe comprising a plurality of lead fingers, said lead fingers including terminal portions;
- attaching the die to the lead fingers;
- electrically connecting bond pads on the die to the terminal portions of the lead fingers;
- forming an encapsulating material on a portion of a face of the die and on the bond pads and the terminal portions of the lead fingers while leaving a remaining portion of the die and remaining portions of the lead fingers exposed;
- trimming the lead fingers to separate the die from the leadframe and form a package comprising the die with the encapsulating material exposed and protecting the bond pads, and with a plurality of leads extending from the encapsulating material.
A method for packaging a semiconductor die comprising:
- providing a lead-on-chip leadframe comprising a plurality of lead fingers;
- attaching the die to the lead fingers;
- electrically connecting bond pads on the die to portions of the lead fingers;
- forming an encapsulating material on a portion of a face of the die and on the portions of the lead fingers while leaving a remaining portion of the die and remaining portions of the lead fingers exposed;
- forming a support structure on the leadframe;
- separating the die and the support structure from a remaining portion of the leadframe;
- testing the die while the support structure remains on the leadframe;
- and
- trimming the lead fingers from the leadframe and support structure to form external leads having the portions thereof connected to the die and protected by the encapsulating material.
A method for fabricating a semiconductor package comprising:
- providing a semiconductor die comprising a face and plurality of bond pads;
- providing a leadframe comprising a plurality of lead fingers;
- attaching the face of the die to the lead fingers;
- wire bonding wires to the bond pads and to the lead fingers;
- covering the wires, the bondpads, and a portion of the face of the die with a viscous material;
- curing the material to encapsulate and protect the bond pads, wires and the terminal ends of the leads, leaving remaining portions of the die exposed;
- and
- trimming the lead fingers to form leads for the package.
Dependencies are inferred from the claim text.