H10W 70/045
Cleaning
Official title: {Cleaning}
H10W70/045 (Cleaning) appears on 81 US grants and 86 published applications in this corpus.
Search patents in H10W- Granted patents
- 81
- Published applications
- 86
- Assignees
- 71
- Inventors
- 240
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 4 | 5 |
| 2003 | 3 | 1 |
| 2004 | 1 | 3 |
| 2005 | 3 | 2 |
| 2006 | 2 | 5 |
| 2007 | 1 | 1 |
| 2008 | 1 | 1 |
| 2009 | 0 | 2 |
| 2010 | 0 | 2 |
| 2011 | 3 | 4 |
| 2012 | 2 | 2 |
| 2013 | 5 | 3 |
| 2014 | 1 | 4 |
| 2015 | 5 | 2 |
| 2016 | 2 | 6 |
| 2017 | 4 | 5 |
| 2018 | 2 | 2 |
| 2019 | 1 | 1 |
| 2020 | 0 | 7 |
| 2021 | 5 | 1 |
| 2022 | 2 | 5 |
| 2023 | 2 | 7 |
| 2024 | 4 | 3 |
| 2025 | 2 | 9 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Metal component including phosphorous-containing nickel layer4 Aug 2026US 12,702,020 B2Mitsui High-Tec, Inc.
- Laser ablation surface treatment for microelectronic assembly24 Feb 2026US 12,564,071 B2Texas Instruments Incorporated
- Cleaning agent and method for manufacturing semiconductor device23 Sep 2025US 12,421,479 B2Kabushiki Kaisha Toshiba
- Semiconductor package having wettable lead flanks and tie bars and method of making the same25 Mar 2025US 12,261,101 B2Alpha and Omega Semiconductor International LP
- Chemically anchored mold compounds in semiconductor packages31 Dec 2024US 12,180,595 B2Texas Instruments Incorporated
- Corrosion resistant power electronic modules30 Jul 2026US 2026/0223709 A1Rockwell Automation Technologies, Inc.
- Laser ablation surface treatment for microelectronic assembly2 Jul 2026US 2026/0191024 A1
- Semiconductor device assemblies with wettable die attach area and associated methods18 Dec 2025US 2025/0385162 A1Semiconductor Components Industries, LLC
- Semiconductor device, power conversion apparatus, and method for manufacturing the same4 Dec 2025US 2025/0374648 A1Kabushiki Kaisha Toshiba
- Method for manufacturing packaged device chips30 Oct 2025US 2025/0336684 A1Disco Corporation
Most cited
By later US patents
- Semiconductor device and method of producing the same99US 5,519,251 AFujitsu Limited · 1996
- Process for manufacturing a semiconductor substrate comprising laminated copper, silicon oxide and silicon nitride layers87US 5,643,834 ASumitomo Electric Industries, Ltd. · 1997
- Lead frame and method of manufacturing the lead frame65US 6,475,646 B2Samsung Techwin Co., Ltd. · 2002
- Drop-in heat sink package with window frame flag48US 5,483,098 AMotorola, Inc. · 1996
- Method of removing flash from a semiconductor leadframe using coated leadframe and solvent40US 5,070,041 AMitsui Petrochemical Industries, Ltd. · 1991