Laser ablation surface treatment for microelectronic assembly

A method for fabricating an electronic device, the method comprising:

• removing an oxide layer from select areas of a surface of a metal structure of a lead frame to create openings that extend through the oxide layer to expose portions of the surface of the metal structure;
• attaching a semiconductor die to the lead frame;
• performing an electrical connection process that electrically couples an exposed portion of the surface of the metal structure to a conductive feature of the semiconductor die;
• enclosing the semiconductor die in a package structure;
• and
• separating the electronic device from the lead frame.

A method of fabricating an electronic device, comprising:

• supporting a semiconductor die in a package structure;
• forming a metal structure, including an oxide layer on a surface of the metal structure, and openings that extend through the oxide layer to expose portions of the surface of the metal structure;
• and
• forming an electrical connection between a conductive feature of the semiconductor die and an exposed portion of the surface of the metal structure in one of the openings through the oxide layer.