Method for manufacturing packaged device chips

A method for manufacturing packaged device chips by dividing a package substrate, on which device chips arrayed on a lead frame are sealed with a mold resin, along divide-preset lines, the lead frame including a plurality of supporting sections to support the device chips on a first surface side thereof and a plurality of electrodes formed on outsides of the supporting sections, the plurality of electrodes each including a recess which is open on a second surface side of the lead frame opposite to the first surface side, the recess being formed in a region to overlap any of the divide-preset lines, the method comprising:

• forming the package substrate by sealing the device chips arrayed on the supporting sections and the plurality of electrodes with the mold resin,
• coating each of the recesses at least partly with a coating material;
• dividing regions including the recesses coated with the coating material along the divide-preset lines to produce the packaged device chips;
• and
• jetting a high-pressure fluid at the coating material coating the recesses to remove the coating material from the recesses.