Lead frame and method of manufacturing the lead frame
AssigneeSamsung Techwin Co., Ltd.
InventorsSe-chul Park, Dong-il Shin, Sung-il Kang, Sang-hoon Lee, Bae-soon Jang
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Abstract
A method for manufacturing a lead frame including the steps of electrocleaning the surface of a thin plate material, electropolishing the electrocleaned thin plate material, removing inclusions on the surface of the electropolished thin plate material, rinsing the inclusion-removed thin plate material with an acidic solution, and forming multi-plated layers on the rinsed material. The lead frame manufactured by the method has 5 or less inclusions each having approximately 1 μm, on the surface area of 1600 μm2, which impede a wire bonding property or solder wettability of the lead frame.
Claims9
A method for manufacturing a lead frame comprising the steps of:
- electrocleaning the surface of a thin plate material;
- electropolishing the electrocleaned thin plate material;
- removing inclusions on the surface of the electropolished thin plate material;
- rinsing the inclusion-removed thin plate material with an acidic solution;
- and
- forming multi-plated layers on the rinsed material.
A lead frame having an inner lead portion and an outer lead portion formed by electropolishing a cleaned thin plate material, removing inclusion on the surface of the electropolished thin plate material having multi-plated layers, rinsing the same and forming multi-plated layers thereon.
A lead frame for a semiconductor device having multi-plated layers including a base metal, inclusions contained in the base metal and a precious metal plated layer formed on the surface from which the inclusions on the surface of the base metal are removed by electropolishing the surface of the base metal.
Dependencies are inferred from the claim text.