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US 2025/0385162 A1Published application
Semiconductor device assemblies with wettable die attach area and associated methods
AssigneeSemiconductor Components Industries, LLC
InventorsRennier Sarmiento RODRIGUEZ, Allen Mortos MENOR, Philip Jay Banagan DE GUZMAN
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Abstract
An assembly includes a conductive surface. The conductive surface includes an area with a hydrophilic surface. The hydrophilic surface is prepared by plasma cleaning. A semiconductor die is disposed on the hydrophilic surface. A coupling layer made of an adhesive material bonds the semiconductor die to the hydrophilic surface. The coupling layer fills a gap between the semiconductor die and the hydrophilic surface.
Claims20
An assembly, comprising:
- a conductive surface including an area with a hydrophilic surface;
- a semiconductor die disposed on the hydrophilic surface;
- and
- a coupling layer made of an adhesive material bonding the semiconductor die to the hydrophilic surface, wherein the coupling layer fills a gap between the semiconductor die and the hydrophilic surface.
1 more element
An assembly, comprising:
- a metal structure including a first portion having a first surface tension, and a second portion having a second surface tension that is less than the first surface tension;
- die attach material disposed on the second portion of the metal structure;
- and
- a semiconductor die disposed on the die attach material.
1 more element
A method, comprising:
- forming a mask with a window on a metal surface;
- cleaning a portion of the metal surface exposed through the window in the mask to define a die attach pad surface;
- removing the mask;
- dispensing a die attach adhesive on the die attach pad surface;
- disposing a semiconductor die on the die attach adhesive on the die attach pad surface;
- and
- performing a die attach operation to secure bonding of the semiconductor die to the die attach pad surface.
4 more elements
Dependencies are inferred from the claim text.