US 12,261,101 B2Granted

Semiconductor package having wettable lead flanks and tie bars and method of making the same

AssigneeAlpha and Omega Semiconductor International LP

InventorsYan Xun Xue, Madhur Bobde, Long-Ching Wang, Xiaoguang Zeng

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Abstract

A semiconductor package includes a lead frame, a chip, and a molding encapsulation. The lead frame comprises a die paddle, a first plurality of leads, additional one or more leads, a second plurality of leads, a first tie bar, a second tie bar, a third tie bar, and a fourth tie bar. A respective end surface of each lead of the first plurality of leads, the additional one or more leads, and the second plurality of leads is plated with a metal. A respective end surface of the first tie bar, the second tie bar, the third tie bar, and the fourth tie bar is not plated with the metal. A method for fabricating a semiconductor package includes the steps of providing a lead frame array, mounting a chip, forming a molding encapsulation, applying a trimming process, applying a plating process, and applying a singulation process.

Claims13

Dependent claims

A semiconductor package comprising:

a lead frame comprising
a die paddle comprising
a first portion;
a second portion electrically isolated from the first portion;
and
a third portion electrically isolated from the first portion and the second portion;
a first plurality of leads extending from the first portion of the die paddle along a first direction;
a first tie bar extending from the first portion of the die paddle along a second direction perpendicular to the first direction;
a second tie bar extending from the first portion of the die paddle along a third direction opposite the second direction;
a third tie bar extending from the second portion of the die paddle along the third direction;
and
a semiconductor chip attached to the die paddle of the lead frame;
and
a molding encapsulation enclosing the chip;
wherein a respective end surface of each lead of the first plurality of leads is plated with a metal;
and
wherein a respective end surface of each of the first tie bar, the second tie bar, and the third tie bar is not plated with the metal.

14 more elements

Dependencies are inferred from the claim text.