H10W 70/041
Connecting or disconnecting interconnections to or from leadframes
Official title: {Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps}
H10W70/041 (Connecting or disconnecting interconnections to or from leadframes) appears on 906 US grants and 1,086 published applications in this corpus.
Search patents in H10W- Granted patents
- 906
- Published applications
- 1,086
- Assignees
- 233
- Inventors
- 1,596
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 5 | 0 |
| 1998 | 1 | 0 |
| 1999 | 7 | 0 |
| 2000 | 2 | 0 |
| 2001 | 10 | 5 |
| 2002 | 7 | 8 |
| 2003 | 4 | 3 |
| 2004 | 4 | 6 |
| 2005 | 2 | 2 |
| 2006 | 7 | 5 |
| 2007 | 2 | 0 |
| 2008 | 2 | 3 |
| 2009 | 0 | 4 |
| 2010 | 8 | 5 |
| 2011 | 3 | 6 |
| 2012 | 1 | 14 |
| 2013 | 4 | 10 |
| 2014 | 17 | 35 |
| 2015 | 37 | 57 |
| 2016 | 68 | 112 |
| 2017 | 91 | 126 |
| 2018 | 100 | 95 |
| 2019 | 79 | 93 |
| 2020 | 96 | 86 |
| 2021 | 60 | 92 |
| 2022 | 60 | 76 |
| 2023 | 69 | 70 |
| 2024 | 60 | 62 |
| 2025 | 49 | 61 |
| 2026 | 26 | 50 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wire bonding using in-situ plasma treatment and apparatus for effecting the same6 Oct 2026US 12,757,746 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of making a multi-chip package device6 Oct 2026US 12,757,800 B2Force Mos Technology Co., Ltd.
- Lead frame with a tie bar having branch part29 Sep 2026US 12,751,294 B2Diodes Incorporated
- Method of manufacturing an interposer product15 Sep 2026US 12,740,435 B2Murata Manufacturing Co., Ltd.
- Integrated circuit25 Aug 2026US 12,721,183 B2Texas Instruments Incorporated
- Method of manufacturing semiconductor device8 Oct 2026US 2026/0314432 A1Renesas Electronics Corporation
- Isolated metal clips with structural bridge8 Oct 2026US 2026/0314452 A1Analog Devices, Inc.
- Semiconductor device with an embedded passive component and method of making the same8 Oct 2026US 2026/0314485 A1Texas Instruments Incorporated
- Double sided multi chip for leaded package1 Oct 2026US 2026/0305380 A1
- Electronic device having an integrated inductor coil1 Oct 2026US 2026/0305427 A1
Most cited
By later US patents
- Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same197US 5,175,060 AIbiden Co., Ltd. · 1992
- Method for bonding a lead to a die pad using an electroless plating solution112US 5,260,234 AVLSI Technology, Inc. · 1993
- Semiconductor device having spherical terminals attached to the lead frame embedded within the package body77US 5,293,072 AFujitsu Limited · 1994
- Lead frame wire bonding by preheating74US 4,434,347 AFairchild Camera and Instrument Corporation · 1984
- Multi-layer lead frames for integrated circuit packages55US 5,025,114 AOlin Corporation · 1991