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US 12,751,294 B2Granted
Lead frame with a tie bar having branch part
AssigneeDiodes Incorporated
InventorsXiaorui Yang, Wei Wu
Life of this patent
Estimating the term…
Abstract
A semiconductor device and a lead frame. The semiconductor device comprises at least one semiconductor chip that is attached to a surface of a base island in a first plane, wherein a connecting rib is connected to the base island, and has a first part which is obliquely connected to the base island; the connecting rib has a second part, and the second part has a surface in a second plane; the second plane is parallel to the first plane and is a plane different from the first plane; the connecting rib has a branch part divided from the second part and the branch part has, in the second plane, a surface used for receiving a lead connected to the semiconductor chip; and the branch part has an edge which is distant from a first edge of the base island by a first distance.
Claims15
A semiconductor device comprising:
- at least one semiconductor chip attached to a surface of a base island in a first plane, wherein a connecting rib is connected to the base island and the at least one semiconductor chip has a first part obliquely connected to the base island;
- wherein the connecting rib has a second part having a surface in a second plane parallel to the first plane and in a plane different from the first plane;
- wherein the connecting rib has a branch part divided from the second part, wherein the branch part has, in the second plane, a surface used for receiving a lead connected to the semiconductor chip, wherein the branch part has an edge that is distant from a first edge of the base island by a first distance;
- wherein the semiconductor device further comprises a second connecting rib, a third connecting rib, and a fourth connecting rib that are connected to the base island at four corners of the base island;
- wherein the semiconductor device further comprises a plurality of lead fingers, each lead finger has a surface in the second plane, the surface of each lead finger is used for receiving a lead connected to the semiconductor chip;
- and
- wherein each lead finger has an edge which is distant from the first edge of the base island by the first distance.
4 more elements
A lead frame for a semiconductor device comprising:
- at least one base island that has, in a first plane, a surface used for receiving a semiconductor chip;
- a connecting rib that is connected to the base island and has a first part obliquely connected to the at least one base island, the connecting rib having a second part, the second part having a surface in a second plane, and the second plane being parallel to the first plane and being a plane different from the first plane;
- a second connecting rib, a third connecting rib, and a fourth connecting rib that are connected to the base island at four corners of the at least one base island;
- and
- a plurality of lead fingers adjacent to the connecting rib;
- wherein the connecting rib has a branch part divided from the second part, the branch part has, in the second plane, a surface used for receiving a lead connected to the semiconductor chip, and the branch part is not directly connected to the adjacent lead finger;
- wherein the branch part has an edge which is distant from a first edge of the base island by a first distance;
- and
- wherein each lead finger has a surface in the second plane, the surface of each lead finger is used for receiving a lead connected to the semiconductor chip, and each lead finger has an edge which is distant from the first edge of the base island by the first distance.
6 more elements
A method for forming a semiconductor package, the method comprising:
- providing a lead frame comprising:
- at least one base island that has, in a first plane, a surface used for receiving a semiconductor chip;
- a connecting rib that is connected to the at least one base island and has a first part obliquely connected to the at least one base island, the connecting rib having a second part, the second part having a surface in a second plane, and the second plane being parallel to the first plane and being a plane different from the first plane;
- a second connecting rib, a third connecting rib, and a fourth connecting rib that are connected to the at least one base island at four corners of the at least one base island, wherein the second connecting rib, the third connecting rib, and the fourth connecting rib each have a branch part divided from a corresponding connecting rib, and the branch parts each have, in the second plane, a surface used for receiving a lead connected to the semiconductor chip;
- and
- a plurality of lead fingers adjacent to the connecting rib;
- wherein the connecting rib has a branch part divided from the second part, the branch part has, in the second plane, a surface used for receiving a lead connected to the semiconductor chip, and the branch part is not directly connected to the adjacent lead finger;
- wherein the branch part has an edge which is distant from a first edge of the base island by a first distance;
- and
- wherein each lead finger has a surface in the second plane, the surface of each lead finger is used for receiving a lead connected to the semiconductor chip, and each lead finger has an edge which is distant from the first edge of the base island by the first distance;
- attaching a semiconductor chip to the base island of the lead frame;
- forming wire bonds between pads on the semiconductor chip and the lead fingers;
- and
- forming an encapsulating material over the semiconductor chip and the lead frame.
11 more elements
Dependencies are inferred from the claim text.