Loading patent…
AssigneeIbiden Co., Ltd.
InventorsRyo Enomoto, Motoo Asai, Yoshikazu Sakaguchi
Estimating the term…
A method of making a semiconductor-mounting substrate suitable for high density packaging and the substrate so made. In order to package an electron part having many terminals to be mounted in a high density, the substrate is constructed by using a lead frame comprised of a die pad and leads as a base, forming an adhesive layer or further an insulating layer onto the lead frame, forming a conductor circuit thereon by an additive process and connecting the conductor circuit and the leads to each other through a plated conductor. According to this construction, it is not required to provide a printed circuit board for IC mounting, and IC can directly be mounted onto the lead frame through the plated conductor circuit.
A semiconductor-mounting substrate comprising a lead frame, an adhesive layer formed on a part of the lead frame, an electrical circuit formed through the adhesive layer by an additive process, and a plated conductor circuit for connecting the said electrical circuit to leads of said lead frame, wherein said adhesive layer is a heat-resistant fine powder being soluble in an oxidizing agent or an acid into a heat-resistant resin being hardly soluble in the oxidizing agent or acid and at least a conductor circuit forming surface thereof is formed as a rough surface by a roughening treatment with said oxidizing agent or acid.
A semiconductor-mounting substrate comprising a lead frame, an insulating material arranged in at least one position among a gap between a lead of the lead frame and a die pad, or a gap between the leads and a surface of the lead frame, an adhesive layer formed on at least a part of the lead frame, an electrical circuit formed through the adhesive layer by an additive process, and a plated conductor for connecting the said electrical circuit to said leads of the lead frame, wherein said adhesive layer is a heat-resistant fine powder being soluble in an oxidizing agent or an acid into a heat-resistant resin being hardly soluble in the oxidizing agent or acid and at least a conductor circuit forming surface thereof is formed as a rough surface by a roughening treatment with said oxidizing agent or acid.
A method of producing a semiconductor-mounting substrate formed by arranging an electrical circuit on a lead frame through an insulating layer, characterized in that said semiconductor-mounting substrate is produced through each of the following steps (a), (b), (c) and (d);
A method of producing a semiconductor mounting substrate formed by arranging an electrical circuit on a lead frame through an insulating layer, characterized in that said semiconductor-mounting substrate is produced through each of the following steps (a), (b), (c), (d) and (e):
A method of producing a semiconductor-mounting substrate formed by arranging an electrical circuit on a lead frame through an insulating layer, characterized in that said semiconductor-mounting substrate is produced through each of the following steps (a), (b), (c) and (d):
A method of producing a semiconductor-mounting substrate formed by arranging an electrical circuit on a lead frame through an insulating layer, characterized in that said semiconductor-mounting substrate is produced through each of the following steps (a), (b), (c), (d) and (e):
Dependencies are inferred from the claim text.