Multi-layer lead frames for integrated circuit packages
AssigneeOlin Corporation
InventorJeffrey S. Braden
Life of this patent
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Abstract
A composite leadframe is provided. The leadframe comprises a rigid metal portion electrically interconnected to a flexible multi-layer portion. When sealed within an electronic package, the composite leadframe provides a higher lead density than achieved by rigid metal leadframes and better electrical and mechanical properties than achieved with flexible leads. The package may comprise a discrete base and cover component with the leadframe disposed between or a monolithic block of plastic encapsulating the electronic device and a portion of the leadframe.
Claims32
A composite leadframe, comprising:
- a rigid metal portion having a plurality of lead fingers extending in cantilever fashion about a centrally positioned aperture;
- a flexible multi-layer portion comprising a plurality of metal foil layers supported and electrically isolated from one another by at least one dielectric layer wherein at least a first metal layer is patterned into a plurality of circuit traces which extend within said centrally positioned aperture, and said circuit traces capable of electrical interconnection to said rigid metal portion, an electronic device or both;
- and
- a means for individually electrically interconnecting each of said circuit traces to a lead finger of said rigid metal portion.
A package adapted to house an electronic device, comprising:
- a base component;
- a cover component;
- a composite leadframe disposed between said base component and said cover component;
- and
- a sealant for bonding said composite leadframe to said base component and to said cover component wherein said composite leadframe comprises a rigid metal portion having a plurality of lead fingers extending in cantilever fashion about a centrally positioned first aperture, a flexible multi-layer portion comprising a plurality of metal foil layers supported and electrically isolated from one another by at least one dielectric layer wherein at least a first metal layer is patterned into a plurality of circuit traces which extend within said centrally positioned aperture, said circuit traces capable of electrical interconnection to said rigid metal portion, an electronic device or both, and a means for individually electrically interconnecting each of said circuit traces to a lead finger of said rigid metal portion.
A package adapted to house an electronic device, comprising:
- a composite leadframe having a rigid metal portion with a plurality of lead fingers extending in cantilever fashion about a centrally positioned first aperture, a flexible multi-layer portion comprising a plurality of metal foil layers supported and electrically isolated from one another by at least one dielectric layer wherein at least a first metal layer is patterned into a plurality of circuit traces which extend within said centrally positioned aperture, said circuit traces capable of electrical interconnection to said rigid metal portion, an electronic device or both, and a means for individually electrically interconnecting each of said circuit traces to a lead finger of said rigid metal portion;
- and
- a molded polymer resin encapsulating said flexible multi-layer portion and at least a portion of said lead fingers.
Dependencies are inferred from the claim text.