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US 12,721,183 B2Granted
Integrated circuit
AssigneeTexas Instruments Incorporated
InventorsYuki Sato, Kenji Otake, Takafumi Ando, Jeffrey Morroni, Charles Allen Devries, Jr., Kristen Nguyen Parrish
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Abstract
An integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate. The coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the coil and the electronic component.
Claims22
An integrated circuit comprising:
- a substrate including contacts on a first surface of the substrate;
- an electronic component over the substrate and coupled to a first subset of the contacts via first interconnects;
- a dielectric material over the substrate;
- a coil in the dielectric material, the coil coupled to a second subset of the contacts via second interconnects;
- and
- an encapsulation material encapsulating the coil, the dielectric material, and at least a portion of the electronic component, the first and second interconnects, or the first surface of the substrate.
3 more elements
Dependencies are inferred from the claim text.