H10W 70/02
Of conductive package substrates serving as an interconnection
Official title: of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04)
H10W70/02 (Of conductive package substrates serving as an interconnection) appears on 1,248 US grants and 1,620 published applications in this corpus.
Search patents in H10W- Granted patents
- 1,248
- Published applications
- 1,620
- Assignees
- 585
- Inventors
- 3,083
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 4 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 8 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 13 | 0 |
| 1999 | 14 | 0 |
| 2000 | 12 | 0 |
| 2001 | 17 | 7 |
| 2002 | 14 | 23 |
| 2003 | 19 | 30 |
| 2004 | 19 | 35 |
| 2005 | 22 | 35 |
| 2006 | 17 | 38 |
| 2007 | 21 | 39 |
| 2008 | 23 | 33 |
| 2009 | 14 | 22 |
| 2010 | 13 | 19 |
| 2011 | 17 | 19 |
| 2012 | 14 | 26 |
| 2013 | 15 | 38 |
| 2014 | 22 | 37 |
| 2015 | 37 | 61 |
| 2016 | 48 | 72 |
| 2017 | 66 | 100 |
| 2018 | 64 | 93 |
| 2019 | 92 | 101 |
| 2020 | 87 | 128 |
| 2021 | 103 | 125 |
| 2022 | 102 | 126 |
| 2023 | 88 | 111 |
| 2024 | 98 | 96 |
| 2025 | 75 | 116 |
| 2026 | 44 | 90 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multichip module thermal management through backside metal8 Sep 2026US 12,733,519 B2Qorvo US, Inc.
- Semiconductor package1 Sep 2026US 12,727,476 B2Samsung Electronics Co., Ltd.
- Power semiconductor device, method for manufacturing same, and power conversion device25 Aug 2026US 12,721,162 B2Mitsubishi Electric Corporation
- Structured microchannel cooling technology by utilizing a novel hard mask pattern transfer fabrication process18 Aug 2026US 12,713,914 B2The Board of Trustees of the Leland Stanford Junior University
- Semiconductor device and manufacturing method thereof4 Aug 2026US 12,702,000 B2Mediatek Inc.
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Semiconductor Device and Method of Forming Fan-Out Wafer Level CPO with Through Silicon Conductive Via1 Oct 2026US 2026/0299219 A1STATS ChipPAC Pte. Ltd.
- Electronic package, manufacturing method thereof, electronic component, and manufacturing method thereof1 Oct 2026US 2026/0305375 A1Siliconware Precision Industries Co., Ltd.
- Semiconductor device and method of manufacturing the same1 Oct 2026US 2026/0305376 A1Renesas Electronics Corporation
- Electronic device having an integrated inductor coil1 Oct 2026US 2026/0305427 A1
Most cited
By later US patents
- Thinned die integrated circuit package312US 6,841,413 B2Intel Corporation · 2005
- Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor218US 4,954,142 AInternational Business Machines Corporation · 1990
- Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor164US 5,084,071 AInternational Business Machines Corporation · 1992
- Methodology of removing misplaced encapsulant for attachment of heat sinks in a chip on board package115US 6,451,709 B1Micron Technology, Inc. · 2002
- Apparatus and method for forming mold for metallic material108US 5,718,361 AInternational Business Machines Corporation · 1998