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US 12,702,000 B2Granted
Semiconductor device and manufacturing method thereof
AssigneeMediatek Inc.
InventorsYu-Jin Li, Bo-Jiun Yang, Tai-Yu Chen, Tsung-Yu Pan, Chun-Yin Lin
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Abstract
A semiconductor device includes a substrate, an electronic component, a cover, a heat conduction component and a dam. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The heat conduction component is disposed between the electronic component and the cover. The dam is disposed between the electronic component and the cover and surrounds the heat conduction component.
Claims8
A semiconductor device, comprising:
- a substrate;
- an electronic component disposed on the substrate;
- a cover disposed on the substrate and covering the electronic component;
- a heat conduction component disposed between the electronic component and the cover;
- and
- a dam disposed between the electronic component and the cover and surrounding the heat conduction component;
- wherein the dam and one of the electronic component or the cover are integrated into one piece with the same material.
4 more elements
Dependencies are inferred from the claim text.