H10W 70/023
Connecting or disconnecting interconnections thereto or therefrom
Official title: {Connecting or disconnecting interconnections thereto or therefrom, e.g. connecting bond wires or bumps}
H10W70/023 (Connecting or disconnecting interconnections thereto or therefrom) appears on 137 US grants and 216 published applications in this corpus.
Search patents in H10W- Granted patents
- 137
- Published applications
- 216
- Assignees
- 93
- Inventors
- 458
- Latest grant
- 7 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 0 | 0 |
| 2003 | 0 | 2 |
| 2004 | 1 | 1 |
| 2005 | 1 | 1 |
| 2006 | 0 | 1 |
| 2007 | 1 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 2 |
| 2013 | 0 | 1 |
| 2014 | 3 | 8 |
| 2015 | 7 | 6 |
| 2016 | 6 | 12 |
| 2017 | 10 | 21 |
| 2018 | 16 | 15 |
| 2019 | 18 | 14 |
| 2020 | 11 | 14 |
| 2021 | 13 | 18 |
| 2022 | 7 | 11 |
| 2023 | 8 | 12 |
| 2024 | 10 | 13 |
| 2025 | 9 | 23 |
| 2026 | 9 | 38 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Semiconductor device with a high thermal dissipation efficiency68US 7,928,565 B2International Business Machines Corporation · 2011
- Electronic circuit component with heat sink mounted on a lead frame57US 5,345,106 ARobert Bosch GmbH · 1994
- Method of manufacturing an electronic circuit component incorporating a heat sink51US 5,202,288 ARobert Bosch GmbH · 1993
- Direct-bonded native interconnects and active base die19US 10,522,352 B2Xcelsis Corporation · 2019
- Mechanisms for forming package structure16US 9,252,065 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016