Mechanisms for forming package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJing-Cheng Lin, Po-Hao Tsai
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Abstract
In accordance with some embodiments, a package structure and a method for forming a package structure are provided. The package structure includes a semiconductor die and a molding compound partially or completely encapsulating the semiconductor die. The package structure also includes a through package via in the molding compound. The package structure further includes an interfacial layer between the through package via and the molding compound. The interfacial layer includes an insulating material and is in direct contact with the molding compound.
Claims15
A package structure, comprising:
- a semiconductor die;
- a molding compound at least partially encapsulating the semiconductor die;
- a through package via in the molding compound;
- a redistribution layer over the molding compound and a back side of the semiconductor die;
- and
- an interfacial layer between the through package via and the molding compound, the interfacial layer comprising an insulating material, the interfacial layer in direct contact with the molding compound, the interfacial layer comprising a planar portion directly in-line between the back side of the semiconductor die and the redistribution layer, and the planar portion is substantially parallel to the back side of the semiconductor die.
A package structure, comprising:
- a semiconductor die;
- a molding compound at least partially encapsulating the semiconductor die;
- a plurality of through package vias in the molding compound;
- a first redistribution layer over the through package vias and a back side of the semiconductor die and electrically connected to one of the through package vias;
- a second redistribution layer over the through package vias and a front side of the semiconductor die and electrically connected to one of the through package vias and a conductive pad of the semiconductor die;
- and
- an interfacial layer between the through package vias and the molding compound, wherein the interfacial layer comprises a polymer material and is in direct contact with the molding compound.
A package structure, comprising:
- a semiconductor die;
- a molding compound at least partially encapsulating the semiconductor die;
- a through package via penetrating through the molding compound;
- a redistribution layer over the molding compound and a back side of the semiconductor die;
- and
- an interfacial layer separating the through package via from the molding compound, the interfacial layer comprising an insulating material, the interfacial layer in direct contact with the molding compound, the interfacial layer comprising a planar portion directly in-line between the back side of the semiconductor die and the redistribution layer, and the planar portion is substantially parallel to the back side of the semiconductor die.
Dependencies are inferred from the claim text.