Electronic circuit component with heat sink mounted on a lead frame
AssigneeRobert Bosch GmbH
InventorsAnton Doering, Ludger Olbrich
Life of this patent
Estimating the term…
Abstract
A standard lead frame has a carrier pierced to produce an opening sufficiently large to make room therein for the mounting of a semiconductor circuit chip. A heat sink for the semiconductor circuit chip is fastened into position in or just below the opening. The semiconductor circuit chip is then affixed directly to the heat sink. After wires have been bonded to connect contact areas of the chip to the conducting paths on the lead frame the unit is encapsulated in such a fashion that a major surface of the heat sink protrudes from the encapsulation. A standard lead frame may be used as the carrier.
Claims4
An electronic circuit component comprising:
- a lead frame (11) of sheet metal having a planar top portion and having, integral therewith, a flat mounting plate (13) which has an aperture (20) therein, said aperture being of a contour similar to that of said mounting plate and being of a size such that said mounting plate forms a peripheral planar strip frame (13') surrounding said aperture, said strip frame being supported in said lead frame by sheet metal strips (14) of said sheet metal of said lead frame, said sheet metal strips (14) integrally joining said strip frame to said lead frame such that said strip frame defines a plane parallel to said planar top portion of said lead frame,
- a heat conducting body (21), seated in said aperture and having a top surface (25) parallel to said plane of said strip frame and parallel to said planar top portion of said lead frame;
- said lead frame having lead connecting portions (41) extending along said top portion thereof, said lead connecting portions terminating adjacent to said strip frame;
- said sheet metal strips (14) being integrally joined to locations of said lead frame which do not have said lead connecting portions thereon (41);
- and
- at least one semiconductor chip (30) affixed to the top surface of said heat conducting body (21) for positioning said at least one semiconductor chip relative to said lead frame, and for passage of heat from said at least one semiconductor chip to said heat conducting body;
- said at least one semiconductor chip being connected to said lead connecting portions by bonding wires (32) having respective ends bonded to respective lead connecting portions of said lead frame;
- and
- said at least one semiconductor chip, said bonding wires, a portion of said lead connecting portions of said lead frame and a portion of said heat conducting body being embedded in and encapsulated by molded electrically non-conducting material.
Dependencies are inferred from the claim text.