Method of manufacturing an electronic circuit component incorporating a heat sink
AssigneeRobert Bosch GmbH
InventorsAnton Doering, Ludger Olbrich
Life of this patent
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Abstract
A standard lead-frame has an aperture pierced to produce an opening sufficiently large to make room therein for the mounting of a semiconductor circuit chip. A heat sink for the semiconductor circuit chip is fastened into position in or just below the opening. The semiconductor circuit chip is then affixed directly to the heat sink. After wires have been bonded to connect contact areas of the chip to respective parts of the lead frame the unit is encapsulate such a fashion that a major surface of the heat sink protrudes from the encapsulation.
Claims10
A method of producing an electric circuit component containing at least one semiconductor chip, incorporating a heat conducting body in contact with said at least one chip and mounted on a single lead frame, said method comprising the steps of:
- piercing an opening (20) in a mounting surface member (13) of said single lead frame (10), which member is connected to the remainder of said lead frame only by several elongate support strips (14) of said lead frame (10), said opening being sufficient to surround an adjacent mounting surface (25) of a heat conducting body (21) and said opening being also sufficient to leave only peripheral elongate portions (13') of said lead frame mounting surface member (13) which peripheral elongate portions define said opening (20) and are attached to said lead frame by said elongate support strips (14);
- inserting at least said mounting surface (25) of said heat conducting body (21) in said opening (20) and attaching said heat conducting body for support thereof, to said peripheral elongate portions of said mounting surface member (13) defining said opening (20) which are attached to said lead frame (10) by said elongate support strips (14);
- affixing said at least one chip on said mounting surface (25) of said heat conducting body (21), and
- thereafter connecting contact areas of said at least one chip to respective tongues (41) of said same lead frame by bonding wires.
Dependencies are inferred from the claim text.