Packages with liquid metal as heat-dissipation media and method forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWensen Hung, Tsung-Yu Chen
Life of this patent
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Abstract
A method includes attaching a permeable plate to a metal lid, with the permeable plate including a metallic material, and dispensing a liquid-metal-comprising media to a first package component. The first package component is over and bonded to a second package component. The liquid-metal-comprising media includes a liquid metal therein. The method further includes attaching the metal lid to the second package component. During the attaching, the liquid-metal-comprising media migrates into the permeable plate to form a composite thermal interface material.
Claims20
A method comprising:
- attaching a permeable plate to a metal lid, wherein the permeable plate comprises a metallic material;
- dispensing a liquid-metal-comprising media to a first package component, wherein the first package component is over and bonded to a second package component, and wherein the liquid-metal-comprising media comprises a liquid metal therein;
- and
- attaching the metal lid to the second package component, wherein during the attaching, the liquid-metal-comprising media migrates into the permeable plate to form a composite thermal interface material.
A method comprising:
- placing a first package component;
- attaching a second package component over the first package component;
- attaching an adhesive over the first package component;
- attaching a metal lid to the first package component through the adhesive, wherein a composite thermal interface material is formed between, and in physical contact with both of, the second package component and the metal lid, and wherein the composite thermal interface material comprises:
- a permeable plate;
- and
- a liquid-metal-comprising media in the permeable plate, wherein the liquid-metal-comprising media comprises a liquid metal, and the liquid-metal-comprising media is a solid at room temperature, and wherein the attaching the metal lid comprises heating the liquid-metal-comprising media as a liquid during the attaching the metal lid to the first package component.
A method comprising:
- encapsulating a device die in a molding compound;
- dispensing a liquid-metal-comprising media as a paste over the molding compound and the device die;
- after the liquid-metal-comprising media is dispensed, forming a composite thermal interface material over and contacting the molding compound and the device die, wherein the composite thermal interface material comprises:
- a metal mesh;
- and
- the liquid-metal-comprising media extending to opposing sides of the metal mesh, wherein the liquid-metal-comprising media comprises a liquid metal, and wherein the liquid metal comprises a material selected from the group consisting of a gallium-based alloy, a bismuth-base alloy, and combinations thereof.
Dependencies are inferred from the claim text.