Circuit device with embedded heat sink

A method for fabricating a circuit device, the method comprising:

• forming electrical contacts on a first surface of a semiconductor die, the semiconductor die comprising a second surface opposite the first surface;
• removing a portion of semiconductor material from the second surface of the semiconductor die to form a recess with respect to the second surface, the recess comprising at least one interior surface;
• providing a metallization layer on the semiconductor material of the at least one interior surface of the recess;
• and
• providing a metal material onto the metallization layer in the recess to at least partially fill the recess with the metal material to form an embedded heat sink in the semiconductor die.