H10W 70/027
Mechanical treatments
Official title: {Mechanical treatments, e.g. deforming, punching or cutting}
H10W70/027 (Mechanical treatments) appears on 246 US grants and 317 published applications in this corpus.
Search patents in H10W- Granted patents
- 246
- Published applications
- 317
- Assignees
- 180
- Inventors
- 665
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 5 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 9 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 6 | 2 |
| 2002 | 3 | 11 |
| 2003 | 3 | 6 |
| 2004 | 7 | 16 |
| 2005 | 8 | 14 |
| 2006 | 9 | 12 |
| 2007 | 6 | 10 |
| 2008 | 5 | 6 |
| 2009 | 2 | 10 |
| 2010 | 3 | 6 |
| 2011 | 6 | 7 |
| 2012 | 7 | 18 |
| 2013 | 4 | 17 |
| 2014 | 7 | 5 |
| 2015 | 15 | 17 |
| 2016 | 8 | 15 |
| 2017 | 14 | 23 |
| 2018 | 11 | 10 |
| 2019 | 16 | 19 |
| 2020 | 16 | 10 |
| 2021 | 11 | 11 |
| 2022 | 9 | 14 |
| 2023 | 11 | 12 |
| 2024 | 15 | 15 |
| 2025 | 8 | 13 |
| 2026 | 4 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power semiconductor device, method for manufacturing same, and power conversion device25 Aug 2026US 12,721,162 B2Mitsubishi Electric Corporation
- Semiconductor device and method for manufacturing the same28 Jul 2026US 12,696,770 B2Fuji Electric Co., Ltd.
- Thermal and mechanical enhanced thermal module structure on heterogeneous packages and methods for forming the same24 Mar 2026US 12,588,505 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for using heat dissipation plate manufacturing apparatus10 Mar 2026US 12,569,948 B2Heat-Sol Corp.
- Method for producing a heat sink having fins and a peripheral side wall30 Dec 2025US 12,508,643 B2Siemens Aktiengesellschaft
- Advanced packaging component with high thermal conductivity and manufacturing method thereof17 Sep 2026US 2026/0282907 A1CMTEK Co., Ltd.
- Structure and formation method of package with thermal conductive structure20 Aug 2026US 2026/0247961 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Thermal and mechanical enhanced thermal module structure on heterogeneous packages and methods for forming the same2 Jul 2026US 2026/0190993 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for bonding heat sink2 Jul 2026US 2026/0191022 A1Horng Terng Automation Co., Ltd.
- Method of manufacturing interconnect substrate25 Jun 2026US 2026/0182391 A1Shinko Electric Industries Co., Ltd.
Most cited
By later US patents
- Apparatus and method for forming mold for metallic material108US 5,718,361 AInternational Business Machines Corporation · 1998
- Method of manufacturing heat sink apparatus72US 4,884,331 AThermalloy Incorporated · 1989
- Carrier with metal bumps for semiconductor die packages62US 6,893,901 B2Fairchild Semiconductor Corporation · 2005
- Flip chip heat sink package and method56US 7,180,745 B2Delphi Technologies, Inc. · 2007
- Integral mesh flat plate cooling module52US 5,825,087 AInternational Business Machines Corporation · 1998