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US 6,893,901 B2Granted
Carrier with metal bumps for semiconductor die packages
AssigneeFairchild Semiconductor Corporation
InventorRuben Madrid
Life of this patent
Estimating the term…
Abstract
A carrier for a semiconductor die package is disclosed. In one embodiment, the carrier includes a metal layer and a plurality of bumps formed in the metal layer. The bumps can be formed by stamping.
Claims13
A method for forming a semiconductor die package, the method comprising:
- (a) forming carrier, wherein forming the carrier comprises providing a metal layer, and forming a plurality of bumps in the metal layer, wherein the formed bumps are capable of being electrically coupled to conductive regions of a circuit substrate, and wherein forming the plurality off bumps comprises stamping;
- and
- (b) attaching a semiconductor die to the metal layer after forming the plurality of bumps wherein attaching comprises:
- attaching the semiconductor die to a die attach region of the carrier, and wherein the plurality of bumps is disposed around the semiconductor die.
1 more element
A method for forming a carrier for a semiconductor die package, the method comprising:
- (a) providing a metal layer;
- and
- (b) forming a plurality of bumps in the metal layer, wherein the formed bumps are capable of being electrically coupled to conductive regions of a circuit substrate, and wherein forming the plurality of bumps comprises stamping, wherein the bumps each have a conical shape.
Dependencies are inferred from the claim text.