Method for bonding heat sink
AssigneeHorng Terng Automation Co., Ltd.
InventorWei-chieh WANG
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AssigneeHorng Terng Automation Co., Ltd.
InventorWei-chieh WANG
Estimating the term…
The present invention provides a method for bonding a heat sink, which includes the following steps: placing a workpiece in a lower jig; supplying an adhesive to a surface of the workpiece; after a suction head of an upper jig picks up the heat sink, moving the upper jig to assemble with the lower jig to form a closed space; evacuating the closed space to create a negative pressure environment; driving the suction head toward the workpiece and bonding the heat sink to the workpiece, during which at least one gap is formed between the heat sink and the adhesive; continuing to drive the suction head to apply pressure to the heat sink, creating a negative pressure within the gap; and restoring the negative pressure environment to atmospheric pressure, allowing the adhesive to fill the gap. The invention effectively resolves the issue of gaps forming during the bonding process.
A method for bonding a heat sink, wherein the method comprising steps of:
Dependencies are inferred from the claim text.