Thermal and mechanical enhanced thermal module structure on heterogeneous packages and methods for forming the same

A device structure, comprising:

• a chip package including a package substrate;
• a fan-out package attached to the package substrate, the fan-out package including a plurality of semiconductor dies;
• a heatsink structure having a heatsink base with a cavity formed therein;
• a thermoelectric cooler (TEC) located within the cavity;
• and
• a fan-out package thermal interface material (TIM) layer contacting a bottom surface of the TEC and top surfaces of the plurality of semiconductor dies in the fan-out package positioned below the heatsink structure.

A method of forming a device structure, comprising:

• forming a heatsink structure having a heatsink base and a cavity within the heatsink base;
• locating a thermoelectric cooler (TEC) within the cavity such that the TEC is positioned to overlie a first physical layer interface of the first semiconductor die and a second physical layer interface of the second semiconductor die in a fan-out package;
• and
• applying a fan-out package thermal interface material (TIM) layer to contact a bottom surface of the TEC, top surfaces of the first semiconductor die and the second semiconductor die, and a top surface of an underfill laterally surrounding the first semiconductor die and the second semiconductor die.