Advanced packaging component with high thermal conductivity and manufacturing method thereof

Abstract

An advanced packaging component with high thermal conductivity and a manufacturing method thereof. The advanced packaging component includes a plate body and a three-dimensional thermal conductivity pattern. The plate body has a first surface and a second surface opposite to each other, and the plate body is formed of a high-rigidity material and has a heat source contact area. The three-dimensional thermal conductivity pattern is formed in the heat source contact area to form at least one thermal conductivity path between the first surface and the second surface. The three-dimensional thermal conductivity pattern is formed of a high thermal conductivity material, so that the at least one thermal conductivity path has a thermal conductivity coefficient greater than 500 W/mK.

Dependencies are inferred from the claim text.