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AssigneeInternational Business Machines Corporation
InventorsSushumna Iruvanti, Martin Klepeis, Gaetano Paolo Messina, Raed Sherif
Estimating the term…
An electronic module is provided comprising integrated circuit chips mounted on a substrate and having a specially designed cooling plate overlying the chip producing a gap above about 1 mil and a thermal paste or thermal adhesive between the cooling plate and the chip to facilitate heat transfer from the chip to the cooling plate. The cooling plate has a roughened area made by grit blasting and the like and having a roughness of about 0.4 to 6.4 microns or comprising a plurality of channels and corresponding protrusions overlying the chip area which roughened area penetrates the thermal paste and thermal adhesive and improves the adhesion and inhibits the flow of thermal paste from between the lower surface of the cooling plate and the upper surface of the chip during operation of the electronic module. A preferred cooling plate comprises a bead blasted roughened surface or plurality of criss-crossing channels forming protrusions having a width of less than about 1 mm and a channel width of about 1 mm to 5 mm.
An electronic module comprising:
A cooling plate for use in electronic modules to overlie integrated circuit chips mounted on a substrate and in which a thermal paste or thermal adhesive having a thickness of above about 1 mil is sandwiched between an upper surface of the chip and a lower surface of the cooling plate to provide a heat transfer medium between the chip and the cooling plate, the cooling plate having on its lower surface a roughened area wherein the roughened area has a texture of peaks and valleys wherein the peaks are about 1.6 to 6.4 microns which roughened area penetrates and improves the adhesion of the thermal paste and/or thermal conductive adhesive and inhibits the flow of thermal paste from between the lower surface of the cooling plate and the upper surface of the chip.
An electronic module comprising:
A cooling plate for use in electronic modules to overlie integrated circuit chips mounted on a substrate and in which a thermal paste or thermal adhesive having a thickness of above about 1 mil is sandwiched between an upper surface of the chip and a lower surface of the cooling plate to provide a heat transfer medium between the chip and the cooling plate, the cooling plate having on its lower surface a roughened area wherein the roughened surface comprises a plurality of channels which channels form a plurality of corresponding protrusions which roughened area penetrates and improves the adhesion of the thermal paste and/or thermal conductive adhesive and inhibits the flow of thermal paste from between the lower surface of the cooling plate and the upper surface of the chip, wherein the ratio of the width of the protrusion to the width of the channel is about 2:1 to 1:10 and the protrusions are a plurality of parallel protrusions.
Dependencies are inferred from the claim text.