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US 2026/0305375 A1Published application
Electronic package, manufacturing method thereof, electronic component, and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsYing-Chi CHI, Hsuan-Jen WANG, Hao-Cheng WANG, Yi-Chun LAI, Hung-Hsiang FANG
Life of this patent
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Abstract
An electronic component of an electronic package is made by forming a multi-layer structure as insulation module on a first side of an interposer to improve the rigidity and mechanical strength of the electronic component, and therefore a warping problem of the electronic component in the electronic package during the thermal process can be avoided.
Claims70
An electronic component, comprising:
- an interposer having a first side and a second side opposite to the first side, and a plurality of conductors formed in the interposer and protruded from the first side of the interposer to serve as conductive protrusions;
- and
- an insulation module being a multi-layer structure comprising a passivation layer and an insulating layer, which being formed on the first side of the interposer and covering a side surface of the conductive protrusions.
A method for manufacturing an electronic component, comprising:
- providing an interposer having a first side and a second side opposite to the first side, and a plurality of conductors formed in the interposer and protruded from the first side of the interposer to serve as conductive protrusions;
- and
- forming an insulation module on the first side of the interposer, and the insulation module covering a side surface of the conductive protrusions, wherein the insulation module is a multi-layer structure comprising a passivation layer and an insulating layer.
Dependencies are inferred from the claim text.