H10W 70/40
Leadframes
H10W70/40 (Leadframes) appears on 14,230 US grants and 14,301 published applications in this corpus.
Search patents in H10W- Granted patents
- 14,230
- Published applications
- 14,301
- Assignees
- 1,829
- Inventors
- 16,968
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 18 | 0 |
| 1977 | 29 | 0 |
| 1978 | 18 | 0 |
| 1979 | 16 | 0 |
| 1980 | 19 | 0 |
| 1981 | 17 | 0 |
| 1982 | 18 | 0 |
| 1983 | 20 | 0 |
| 1984 | 27 | 0 |
| 1985 | 24 | 0 |
| 1986 | 39 | 0 |
| 1987 | 39 | 0 |
| 1988 | 50 | 0 |
| 1989 | 67 | 0 |
| 1990 | 89 | 0 |
| 1991 | 118 | 0 |
| 1992 | 137 | 0 |
| 1993 | 145 | 0 |
| 1994 | 217 | 0 |
| 1995 | 202 | 0 |
| 1996 | 206 | 0 |
| 1997 | 186 | 0 |
| 1998 | 278 | 0 |
| 1999 | 283 | 0 |
| 2000 | 325 | 0 |
| 2001 | 349 | 172 |
| 2002 | 348 | 411 |
| 2003 | 351 | 376 |
| 2004 | 358 | 368 |
| 2005 | 307 | 429 |
| 2006 | 312 | 395 |
| 2007 | 271 | 483 |
| 2008 | 251 | 539 |
| 2009 | 278 | 591 |
| 2010 | 421 | 507 |
| 2011 | 446 | 495 |
| 2012 | 472 | 492 |
| 2013 | 499 | 522 |
| 2014 | 547 | 639 |
| 2015 | 641 | 659 |
| 2016 | 622 | 666 |
| 2017 | 655 | 626 |
| 2018 | 554 | 587 |
| 2019 | 550 | 623 |
| 2020 | 562 | 709 |
| 2021 | 507 | 672 |
| 2022 | 508 | 667 |
| 2023 | 476 | 716 |
| 2024 | 498 | 799 |
| 2025 | 481 | 705 |
| 2026 | 379 | 453 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 70/421Shapes or dispositions6,563
- H10W 70/411Chip-supporting parts4,891
- H10W 70/464Additional interconnections in combination with leadframes3,909
- H10W 70/481For devices being provided for in groups h10d8/00 - h10d48/003,452
- H10W 70/456Materials2,070
- H10W 70/479On or in insulating or insulated package substrates, interposers, or redistribution layers1,487
- H10W 70/461Specially adapted for cooling1,167
- H10W 70/453Comprising flexible metallic tapes725
Recent patents
- Half-bridge circuit using monolithic flip-chip GAN power devices6 Oct 2026US 12,756,203 B2Navitas Semiconductor Limited
- Semiconductor packages with wettable flanks and related methods6 Oct 2026US 12,757,696 B2Semiconductor Components Industries, LLC
- Semiconductor package assembly with electric field modulation structures6 Oct 2026US 12,757,751 B2Nexperia B. V.
- Semiconductor device with reverse and observe surfaces6 Oct 2026US 12,757,752 B2Rohm Co., Ltd.
- Electronic device with high draft angle package structure6 Oct 2026US 12,757,753 B2Texas Instruments Incorporated
- Die attachment structure and method8 Oct 2026US 2026/0314435 A1NXP USA, Inc.
- Semiconductor package with an embedded interconnect and a method of making the same8 Oct 2026US 2026/0314436 A1Texas Instruments Incorporated
- Semiconductor device and method of manufacturing semiconductor device8 Oct 2026US 2026/0314437 A1Mitsubishi Electric Corporation
- Semiconductor device package for press fit assembly8 Oct 2026US 2026/0314438 A1
- Grounded leads in a quad-flat package8 Oct 2026US 2026/0314439 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Analyte monitoring device and methods of use2,634US 6,175,752 B1TheraSense, Inc. · 2001
- Analyte monitoring device and methods of use2,053US 6,565,509 B1TheraSense, Inc. · 2003
- Analyte monitoring device and methods of use1,062US 7,190,988 B2Abbott Diabetes Care Inc. · 2007
- Analyte monitoring devices and methods of use1,055US 7,003,341 B2Abbott Diabetes Care Inc. · 2006
- Analyte monitoring device and methods of use1,007US 6,990,366 B2TheraSense, Inc. · 2006