Grounded leads in a quad-flat package

A method for grounding a grounded lead in a lead-frame package, the method comprising:

• providing a lead-frame comprising:
• a tie bar, wherein the tie bar is electrically grounded;
• and
• a plurality of leads, including at least:
• the grounded lead;
• and
• an intervening lead, wherein the intervening lead is positioned between the grounded lead and the tie bar;
• attaching an insulating adhesive material to a surface of the intervening lead;
• and
• positioning a conductive material on a surface of the insulating adhesive material opposite the intervening lead, wherein the conductive material electrically connects the grounded lead to the tie bar.

A lead-frame package comprising:

• a die pad, wherein the die pad is electrically grounded;
• an integrated circuit attached to the die pad;
• a lead-frame comprising:
• a tie bar, wherein the tie bar is electrically connected to the die pad;
• and
• a plurality of leads, including at least:
• a grounded lead;
• and
• an intervening lead, wherein the intervening lead is positioned between the grounded lead and the tie bar;
• an insulating adhesive material attached to a surface of the intervening lead;
• and
• a conductive material positioned on a surface of the insulating adhesive material opposite the intervening lead;