Die attachment structure and method

Abstract

The present disclosure relates a package assembly including an integrated circuit die having standoff structures and associated methods of die attach and fabrication. The package may include an integrated circuit die having standoff structures disposed on a bottom surface of the integrated circuit die, a die pad structure on which the integrated circuit die is disposed, and die attach material disposed between the integrated circuit die and the die pad structure. The standoff structures can include metallic ink. The standoff structures may contact an upper surface of the die pad structure. The die attach material may attach the integrated circuit die to the die pad structure.

Dependencies are inferred from the claim text.